EMI/RFI shielding in electronics

ElectronicsReticulated PU foam with conductive metal coating (silver, nickel, copper)PU foam with dispersed conductive particlesReticulated PU foam for conductive gaskets

See also: Lighting, Water and Telecommunications · Mobility · Industrial Manufacturing and Chemicals

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What it is

What it is

EMI/RFI (Electromagnetic Interference / Radio Frequency Interference) shielding foams are reticulated PU foams (fully open cells) metallized or impregnated with conductive particles, used as conductive seals between components of electronic enclosures. The function is dual: mechanically sealing enclosure joints (preventing dust and humidity ingress) and forming a continuous conductive path that blocks electromagnetic interference emission and reception. Critical applications: server and datacenter enclosures, telecommunications equipment (5G base stations), military electronics, medical devices sensitive to EMI (MRI, monitoring equipment), aerospace equipment, automotive electronics (especially in EVs with high electronic density). Growing market strongly driven by 5G, industrial IoT and electronic densification in electric vehicles.

Why it matters

Why it matters

For electronics manufacturers and EMS, emi/rfi shielding foams is a decision simultaneously impacting unit cost, field failure rate, regulatory certification and production cycle time. Wrong material costs cents per unit and hundreds of millions in accumulated recall. Right material delivers years of operation without failure even in aggressive environments.

Current drivers. Miniaturization and power density grow in all segments — each generation packs more function per cm², generating more heat and more contamination vulnerability. Regulation of electronics in specific environments (medical ISO 13485, automotive IATF 16949, aerospace AS9100) gets stricter. And industrial electrification (5G, EVs, Industry 4.0, IoT) created new consumer segments in accelerated expansion.

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