Thermal interface materials (TIM) in electronics

Thermal pads are thermal interface materials (TIM — Thermal Interface Material) applied between heat-generating electronic components (processors, GPUs, power drivers, high-power LEDs) and thermal dissipators (heatsinks, metal chassis, coldplates). The function is to fill surface microimperfections and create an efficient thermal path from the hot component to the dissipator. PU thermal pads compete with silicone pads (dominant) and with thermal pastes, offering specific advantages: less bleeding (do not migrate over time), can have adjustable mechanical properties (some are semi-rigid, others gel-like), and are easier to handle in automated application. Typical thermal conductivity: 1 to 12 W/m·K depending on ceramic loading (alumina, boron nitride, aluminum nitride). Applications in strong growth: EV batteries, 5G base stations, datacenter servers, high-power LEDs.